文章摘要
引用本文:赵雪薇,阎璐,邢朝洋,李男男,朱政强.微系统集成用倒装芯片工艺技术的发展及趋势[J].导航与控制,2019,(5):11-21 本文二维码信息
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微系统集成用倒装芯片工艺技术的发展及趋势
Development and Trend of Flip Chip Technology for Microsystem Integration
  
DOI:
中文关键词:  倒装芯片技术  芯片凸点  硅通孔转接板  底填充
English Keywords:flip chip technology  wafer bumping  through Silicon via interposer  underfill
基金项目:
作者单位
赵雪薇 北京工业大学北京 100124北京航天控制仪器研究所北京 100039 
阎璐 北京航天控制仪器研究所北京 100039 
邢朝洋 北京航天控制仪器研究所北京 100039 
李男男 北京航天控制仪器研究所北京 100039 
朱政强 北京航天控制仪器研究所北京 100039 
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中文摘要:
      倒装芯片(Flip Chip,FC)技术是一种应用广泛的集成电路电子封装技术。随着电子产品不断向小型化和多功能化方向升级,尤其是在微系统集成领域飞速发展的驱动下,FC技术也在不断发展以满足细节距和极细节距芯片的封装要求。同时,FC技术也在工业化的过程中追求着性能、成本和封装效率的平衡。将FC封装体分为芯片凸点、基板以及底填充材料三个主要部分,深入讨论了FC封装的主流工艺和新兴工艺,介绍了各个工艺的流程及优缺点。此外,还分析了FC封装体在热、力以及电载荷作用下的可靠性问题。
English Summary:
      Flip chip technology is a widely used integrated circuit electronic packaging technology. With the development of electronic products towards miniaturization and multifunction, especially driven by the rapid development of microsystem integration, FC technology has been developed to meet the packaging requirements of chips with fine pitch and ultrafine pitch. At the same time, the balance of performance, cost and packaging efficiency has been pursued in the process of industrialization of FC technology. In this paper, FC assembly is divided into three parts: wafer bumping, substrate and underfill. The main and new technologies of FC are discussed in depth. In addition, the reliability of FC assembly under thermal, mechanical and electrical loads is also analyzed.
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