文章摘要
引用本文:李博洋,孙国良,王帅民,牛昊斌,孙俊杰.MEMS加速度计的封装建模与粘胶优化[J].导航与控制,2019,(4):71-76 本文二维码信息
二维码(扫一下试试看!)
MEMS加速度计的封装建模与粘胶优化
Packaging Modeling and Viscose Optimization of MEMS Accelerometer
  
DOI:
中文关键词:  MEMS加速度计  封装建模  粘胶  热应力
English Keywords:MEMS accelerometer  packaging modeling  viscose  thermal stress
基金项目:
作者单位
李博洋 中国航空工业集团公司西安飞行自动控制研究所西安 710076 
孙国良 中国航空工业集团公司西安飞行自动控制研究所西安 710076 
王帅民 中国航空工业集团公司西安飞行自动控制研究所西安 710076 
牛昊斌 中国航空工业集团公司西安飞行自动控制研究所西安 710076 
孙俊杰 中国航空工业集团公司西安飞行自动控制研究所西安 710076 
摘要点击次数: 5
全文下载次数: 8
中文摘要:
      随着MEMS加速度计应用领域的逐渐扩大,其工作环境的温度区间跨度也在不断增大,如何降低由封装过程引入的温度漂移量是MEMS加速度计设计的关键。对一种玻璃-硅-玻璃梳齿加速度计的完整封装结构进行了建模,并且对5种粘胶方式进行了热应力形变仿真,对仿真中温度性能最好的远三点粘胶和最差的全面粘胶这两种方式进行了装表与温度系数测试。实测结果表明,远三点粘胶的加速度计温度性能相比全面粘胶提升了2.5倍,与仿真结果相符。
English Summary:
      With the expansion of the application field of MEMS accelerometer, the temperature range of its working environment is also increased gradually. How to reduce the temperature drift introduced by packaging process is the key to the design of MEMS accelerometer. In this paper, the whole packaging structure of a Glass-Silicon-Glass comb accelerometer is modeled, and the thermal stress deformation is simulated for five different viscose ways. In the simulation, the far-three-point-viscose packaged accelerometer with the lowest temperature drift and the comprehensive viscose with the highest temperature drift are tested. The measured results show that the far-three-point-viscose packaged accelerometer performed 2.5 times better than the comprehensive-viscose packaged accelerometer in temperature drift, which is consistent with the simulation result.
查看全文  查看/发表评论  下载PDF阅读器